Method of forming a split poly-SiGe/poly-Si alloy gate stack

ABSTRACT

A multi-layered gate electrode stack structure of a field effect transistor device is formed on a silicon nano crystal seed layer on the gate dielectric. The small grain size of the silicon nano crystal layer allows for deposition of a uniform and continuous layer of poly-SiGe with a [Ge] of up to at least 70% using in situ rapid thermal chemical vapor deposition (RTCVD). An in-situ purge of the deposition chamber in a oxygen ambient at rapidly reduced temperatures results in a thin SiO 2  or Si x Ge y O z  interfacial layer of 3 to 4 A thick. The thin SiO 2  or Si x Ge y O z  interfacial layer is sufficiently thin and discontinuous to offer little resistance to gate current flow yet has sufficient [O] to effectively block upward Ge diffusion during heat treatment to thereby allow silicidation of the subsequently deposited layer of cobalt. The gate electrode stack structure is used for both nFETs and pFETs.

The present application is a continuation application of a U.S. Pat.application Ser. No. 11/124,978, filed May 9, 2005 now U.S. Pat. No.7,378,336 which application is a divisional application of U.S. patentapplication Ser. No. 10/680,820, filed Oct. 7, 2003 and allowed on Apr.6, 2005, now U.S. Pat. No. 6,927,454B2.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a field effect transistor structuresand, more particularly, to a field effect transistor structures with amulti-layered gate electrode structures and process of making same.

2. Background and Related Art

Various types of integrated circuits are fabricated on semiconductorsubstrates and p-channel type field effect transistors and n-type fieldeffect transistors are major circuit components of the integratedcircuits. The desire for increased speed and density, however, hasresulted smaller and smaller gate electrodes and extremely thin gateinsulating layers. This has, in turn, resulted in what has been calledthe “short channel” effect which tends to occur in field effecttransistors due to narrow gate widths.

One solution to the problem of “short channel” effect has been theintroduction of dopant impurity, opposite to the channel conductivity,into the gate electrode. Boron, for example, is introduced into thepolysilicon gate electrodes of p-channel type field effect transistors(pFETs) and arsenic or phosphorous is introduced into the polysilicongate electrodes of n-channel type field effect transistors (nFETS).

Although this solution is effective in overcoming the “short channel”effect problem, it has manifested at least one other problem in itseffective implementation. This problem is centered on the fact that thethermal energy required for activation of dopant impurity is verydifficult to adjust. If the thermal energy is large, most of borondopants in the gate electrode is fully activated. However, because thediffusivity of boron in silicon is high, atomic boron penetrates throughgate insulating layer into the Si-channel. As a result, this createsanother short channel effect problem. On the other hand, if the thermalenergy is not sufficient, boron dopant is partially activated, leaving aconsidered amount of boron inactive at the boundary between the gateinsulating layer and gate electrode. This creates gate electrondepletion affecting, in turn, the integrity of the threshold of thegate.

A solution to this latter problem has been found by introducinggermanium into the structure. This has been implemented in the prior artin a boron-doped multi-layered structure by including a layer ofsilicon-germanium (SiGe). Thus, multi-layered gate structures maycomprise, for example, an amorphous silicon layer on the gate insulatinglayer and a SiGe layer laminated on the amorphous silicon layer. Apolysilicon layer is, in turn, laminated on the SiGe layer and a cobaltsilicide layer is then formed in self-aligned manner on the polysiliconlayer. The germanium in the SiGe layer is thought to enhance activationof the boron doped in the silicon thereby reducing, or possiblyeliminating, the amount of inactive boron and the resulting gateelectrode depletion. Such an arrangement has been described in U.S.Patent Application Publication US2003/0049919A1.

Regardless of the mechanism, the electrically active concentration ofboron in the SiGe polycrystalline multi-layer gate electrode structurehas been demonstrated to significantly reduce gate electrode depletionin pFETs. For simplicity of integration, it is advantageous to use thesame SiGe polycrystalline multi-layer electrode structure on nFETs dopedwith arsenic or phosphorous. However, it has been found that the high Geconcentration in the polysilicon results in very poor CoSi₂ formation onthe gate structures, and particularly on the nFET gate structures.

The poor CoSi₂ formation has been attributed to the fact that the Gediffusion coefficient in the SiGe alloy through poly-grain boundaries isextremely high. Because of the large thermal energy employed in CMOSintegration, the Ge is up-diffused and achieves equilibrium through thepoly gate. Therefore, poly-silicide formation of the poly-SiGe alloygate and metal cobalt is practically impossible since cobalt isunreactive chemically with the element Ge. This results in, at best, ina coagulated and discontinuous layer of CoSi₂ on the poly-SiGe alloygate. The end result is a high resistive gate. On the other hand, theelement Ge is also known to have a high surface energy and, thus, theSiGe alloy material is extremely difficult to be made to chemicallyabsorb on the gate dielectric structure of multi-layer polysilicon gatestructures. In this regard, poly-SiGe alloy gate structures with low Geconcentrations can be formed on gate insulating layers. However, as Geconcentration is increased up to around 20% and above, SiGe alloybecomes discontinuous.

SUMMARY OF THE PRESENT INVENTION

It is, therefore, an object of the present invention to provide animproved FET device and method for making same.

It is a further object of the present invention to provide an improvedFET device gate structure and process for so making.

It is another object of the present invention to provide an improved FETdevice and process therefor that permits the use of a single gate stackstructure for nFETs and pFETs.

It is yet another object of the present invention to provide a FET gatestructure that is simple, easy to fabricate and provides reliable gatecontrol.

It is still yet another object of the present invention to provide asimple gate structure that is effective to avoid the deleterious effectsof the thermal energy required to be employed for FET devicefabrication.

In accordance with the present invention, a simple process and materialsolution acts to allow the use of a single gate stack structure for bothnFETs and pFETs and results in both n-gate and p-gate electrode stackswhich are easily silicided and p-gate electrodes with high boronactivation and, hence, little gate electrode depletion. This is achievedby employing an insitu Rapid Thermal Chemical Vapor Deposition (RTCVD)process for creating an effective SiGe polycrystalline multi-layer gateelectrode structure.

The RTCVD process is employed to first form the gate dielectric of SiO₂,for example. The process is then employed to grow a layer ofnano-crystal Si silicon seeds on the gate dielectric. This, in turn,permits the deposition of poly-SiGe at high Ge concentrations. An insitu purge of the deposition chamber forms an atomic or monolayer layerof amorphous dielectric material, such as, a monolayer of SiO₂ orSi_(x)Ge_(y)O_(z). This occurs when a controlled amount of oxygen, O₂reacts with the SiGe alloy surface at a low temperature and pressureregime, thereby producing a monolayer or atomic layer of amorphous SiO₂or Si_(x)Ge_(y)O_(z). The chamber is then returned to the depositionmode wherein a layer of polysilicon is deposited. A layer of CoSi₂ maythen readily be formed on the polysilicon.

The gate structure thus formed, in accordance with the presentinvention, is such that the nanocrystalline Si layer allows bothcontinuity of RTCVD poly SiGe deposition even at high Ge concentrationsand formation of small grain size. In turn, the small grain size of thenanocrystalline Si layer allows both enhanced boron diffusion and boronactivation. The formation of a monolayer of SiO₂, for example, on thepoly-SiGe is sufficiently thin to readily permit current flow but yet issufficient to block diffusion upwardly in the gate stack to thepolysilicon layer so as to thereby allow good formation of CoSi₂,particularly on nFET gate structures.

BRIEF DESCRIPTION OF THE DRAWING

FIG. 1 shows a cross-sectional view of a p-channel type FET (pFET) witha gate stack structure, in accordance with the present invention.

FIGS. 2A-2E show cross-sectional views depicting the progression ofstructure development in the steps employed to fabricate complementarypFETs and nFETs with the gate stack structure, in accordance with thepresent invention.

FIGS. 3A-3E are cross-sectional views used to describe a process forfabricating the gate structure, according to the present invention.

FIG. 4 shows a schematic approximate reproduction of a top view of alayer of Si nano crystal, as taken by a scanning electron microscope.

DETAILED DESCRIPTION

With reference to FIG. 1, there is shown a cross-section of a pFET witha gate stack structure, as provided in accordance with the presentinvention. Other than the gate stack structure, the arrangement is aconventional configuration, as is understood by those skilled in theart, and represents only a portion of an integrated circuit structurewherein other pFETs and complementary nFETs may be fabricated on thesame substrate. The pFET shown would typically be fabricated on p-typesilicon (Si) substrate material (not shown) with p-type expitarial layer1 formed thereon. A p-type dopant impurity is typically ion implantedinto this selected region and an n-type well 3 is formed in theepitaxial layer 1. An nFET on this same substrate would be formed bymasking the pFET region with a photoresist, for example, and then ionimplanting on an n-type dopant into the nFET region. Shallow trenchisolating regions 5 are formed which define the active region. An oxidelayer 43 is then formed and the gate stack structure 7, in accordancewith the present invention, is then formed. The P+ source and drainregions 19 are formed in epi layer 3 in conventional manner. It shouldbe noted that the various layers and regions are not to scale.

The gate stack structure, in accordance with the present invention,comprises Si nano-crystal layer 41, poly-SiGe layer 45, SiO₂ interfacialmono layer 47, poly-Si layer 49 and CoSi₂ layer 51. The details of suchlayers and manner of fabrication will be explained hereinafter.

FIGS. 2A-2E show cross-sectional views depicting the progression ofstructure development in the steps which may be employed in fabricatingnFETs and pFETs with the gate stack structure, in accordance with thepresent invention. The gate stacks 21N for the nFET and 21P for the pFETare shown for convenience to include the typical prior art layers of thesame material for each, stacked on oxide layer 23. Typically, such astack would comprise an amorphous silicon layer on oxide layer 23followed by a layer of SiGe with the later topped with a poly-Si layer.It is also known to provide additional layers on the poly-Si layer. Insuch arrangements, a barrier layer of SiO may be deposited on thepoly-Si followed by a layer of amorphous Si on the barrier SiO layer.Such an arrangement has been described, for example, in U.S. PatentApplication Publication US 2003/0049919A1. The above-described barrierlayer is taught to act as a barrier against Ge diffusion.

It should be noted that the Si layer on the gate oxide in theabove-identified patent publication is amorphous Si with a grain sizetypically in the range of 800 to 900 Angstrom (A) after anneal. Suchgrain size tends to limit the grain size of the SiGe alloy layer to bedeposited thereon and the amount of Ge, i.e. [Ge], that can be depositedin the alloy. In addition, the grain size limits boron diffusion uponboron doping and subsequent gate activation.

The SiO_(x) barrier in the above-identified publication is taught to bein the thickness range of 0.5 to 1.5 nm. Such thicknesses tend to limitcurrent flow in the gate stack, i.e., create higher than desirableresistance. In addition, such thicknesses are not created in situ butnecessitate removal from the deposition chamber.

With reference to FIG. 2A, before the gate stacks 21N and 21P areformed, a p-type dopant impurity is ion implanted into p-type epi layer3 on substrate 1 to form p-type well 25, an n-type dopant impurity ision implanted into the epi layer to form an n-type well 27 and isolatingregion 29 is formed. Here, shallow trench isolation is employed whichisolation defines the active area region of the devices. At this pointin the process, gate stack structures represented by 21N and 21P arethen formed.

In accordance with the present invention, a gate stack structure 7, asrepresented in FIG. 1, is formed. The steps of forming gate stackstructure 7 are best described with reference to FIGS. 3A-3E. Theprocess starts, as shown in FIG. 3A, with depositing a Si nano crystallayer 41 on gate dielectric 43. Gate dielectric 43 may be a layer ofSiO₂. The Si nano crystal layer is deposited by Rapid Thermal ChemicalVapor Deposition (RTCVD) using SiH₄ gas to react with the Si substrateat 600° C. and 5 to 20 Torr pressure for 5 to 10 seconds. The Si nanocrystal layer is deposited to a thickness of 30 to 60 A with a grainsize of 2 to 10 nm in diameter of generally hemispherical shape. Grainsizes in the range from 30 to 200 A in diameter have also been found tobe effective. These particles act as a Si seed layer on the gatedielectric facilitating subsequent small grain size poly-SiGe surfacegrowth thereon.

An alternative approach to forming the Si nano crystal layer is by spinon deposition. For example, a spin on Si nano crystal layer can beformed by spin casting a dilute colloidal suspension of porous Sinanoparticles (˜1 nM). p-type Si was anodically etched in HF: ethanol(1:4) for 30 min. The resulting porous silicon layer was mechanicallyremoved from the surface and sonicated in hexanes to reduce particlesize. The sonicated solution was filtered through a 200 nm filter toyield a stock solution. Only the smallest particles are suspended in thestock solution due to its finite solubility in hexane.

FIG. 4 shows an approximate graphic representation of a top view of alayer of Si nano crystal as taken by a scanning electron microscope. Ascan be seen from the 100 nm reference on FIG. 4, the crystal grain sizesexhibit a diameter substantially less than 100 nm with a density ofabout e13 (10¹³) particles/cm².

With reference to FIG. 3B, after deposition of the Si nano crystal layer41, a uniform and continuous poly-SiGe alloy layer 45 is deposited ontop of the nano crystal Si seeds. This layer is deposited in situ in theRTCVD chamber using 100 sccm of SiH₄ and 65 sccm of GeH₄ to form SiGe of25% at 650° C. and 20 Torr pressure. As GeH₄ gas flow increases to 140sccm to react with the same amount of SiH₄, a poly-SiGe 45% alloy layeris formed. Further increases in the GeH₄ gas flow with the same amountof SiH₄ will take the Ge concentration in alloy up to at least 70%. Itshould be noted, again, that the thicknesses of layers depicted in FIGS.3A-3E are not to scale nor necessarily accurate relative to one another.

The deposited poly-SiGe alloy layer 45 is typically 100 nm thick andshows continuity with the underlying Si nano crystal layer. Thepoly-SiGe alloy grain size diameter typically averages a relativelyuniform 400 A with the Si nano crystal seeds providing the growthstructure for such small uniform grain sizes. The small grain size ofthe poly-SiGe alloy layer, in turn, allows for concentrations of Ge inthe alloy of up to at least 70% with the continuity of the RTCVD-formedpoly-SiGe being maintained over such [Ge] range. Typically, Geconcentrations of approximately 25% and above would otherwise causediscontinuous poly-SiGe.

With reference to FIG. 3C, after RTCVD of the poly-SiGe alloy layer, aninterfacial layer 47 of one or two monolayers of ultra thin SiO₂ orSi_(x)Ge_(y)O_(z) is grown in situ. RTCVD permits temperature change asrapid as 50° C./sec. An in situ purge of the deposition chamber in anoxygen ambient at rapidly reduced temperature levels, such as 300° C. to500° C., results in a thin SiO₂ or Si_(x)Ge_(y)O_(z) interfacial layerof 2 to 4 A. The SiO₂ or Si_(x)Ge_(y)O_(z) layer formed using RTCVDprovides well controlled thickness with in situ growth without breakingthe chamber pressure for the whole gate electrode deposition.

The ability of RTCVD to rapidly ramp up and down in temperature isimportant in minimizing Ge diffusion into other layers and formation ofenough Si_(x)O_(y) or Si_(x)Ge_(y)O_(z). Such Si_(x)O_(z) layer, whichis typically SiO₂, is, however, sufficiently thin that the structure ofthe barrier may generally take the form characterized by the expressionSi_(x)Ge_(y)O_(z). Since this one or two monolayer interfacial layercontaining [O] is extremely thin, it is difficult to identify itsprecise composition analytically. Accordingly, the best formulation hasbeen found to be Si_(x)Ge_(y)O_(z) which indicates that both Si and Gehave opportunity to form “oxides”. The resultant effect was detected bySIMS analysis that show the blocking function of Ge up-diffusion fromPoly-Si layer 45.

It should be noted that the SiO₂ or Si_(x)Ge_(y)O_(z) monolayer 47 issufficiently thin so as to not be continuous. As a result, monolayer 47can be electrically conductive so as to pass current but yet there isenough [O] to stop Ge which may otherwise diffuse into the subsequentlydeposited poly-Si layer, shown in FIG. 3D. Thus, SiO₂ orSi_(x)Ge_(y)O_(z) monolayer 47 is a barrier to Ge but yet does notcreate a significant resistance to current flow in the gate stack.

After growth of SiO₂ or Si_(x)Ge_(y)O_(z) interfacial layer 47, a thinpoly-Si film 49 is deposited on top of the SiO₂ or Si_(x)Ge_(y)O_(z)layer, as shown in FIG. 3D. The poly-Si layer 49 is approximately 300 Athick and is deposited by reaction of 0.7 slm of SiH₄ at 710° C. and 15Torr. The thin poly-Si layer is used for Co silicidation since poly-Sireadily reacts with Co to form CoSi₂ while Ge does not.

FIG. 3E shows an alternative gate stack structure to that shown in FIG.3D. The difference in the gate stack structure shown in 3E from thatshown in FIG. 3D is in the inclusion of poly-Si layer 51. Such layer isdeposited in situ on poly SiGe 45 to a thickness of approximately 100 to300 A employing a gas reaction of 0.7 slm of SiH₄ gas at 710° C. and 15Torr. As can be seen, interfacial layer 47 splits the poly-Si gateelectrode of the gate stack. The advantage of including poly-Si layer 51in the gate stack is that it further facilitates the growth ofultra-thin interfacial layer 47 of SiO₂. This ultra-thin interfacialoxide layer results from low temperature [˜400° C.] oxidation on thepoly-Si surface based upon the reaction of O₂+Si→SiO₂ without Geinvolvement, as was the case in the arrangement of FIG. 3D.

Again, with reference to FIGS. 2A-2E, after formation of the gate stackstructures shown in FIGS. 3D and 3E, the process continues in theformation of complementary nFETs and pFETs. It should be noted that thegate stack structures 21N and 21P for respective nFET device and pFETdevice are the same thereby simplifying the process. As shown in FIG.2B, the gate stack structure 21P is then covered with a maskingphotoresist 31 formed through photolithography. This leaves gate stackstructure 21N and adjacent active region 25 exposed so that they may beion implanted with an n-type dopant such as, for example, phosphorous.Phosphorous is implanted with an acceleration energy sufficient to reachinto the polysilicon layer 49 in FIGS. 3D and 3E. Thus, n-type dopedregions 35 n on each side of the gate stack are produced in self-alignedmanner.

Similarly, as shown in FIG. 2C, gate stack structure 21 n is coveredwith a photoresist 33 leaving gate stack structure 21 p and activen-type well area 27 exposed. Boron, for example, may then be ionimplanted into gate stack structure 21P and surrounding active region.As with gate stack structure 21N, the boron is implanted with anacceleration energy sufficient to reach into the poly-Si layer 49, asshown in FIGS. 3D and 3E. Again, self-aligned p-type doped regions 35 pare formed on each side of gate stack structure 21P.

As shown in FIG. 2D, oxide sidewall insulating spacers 37 and 39 areformed on the sidewalls of the gate stack structures and then a layer 30of cobalt is conformally deposited over the entire surface of theresultant semiconductor structure.

The structure is then subjected to a heat treatment wherein theion-implanted boron and ion-implanted phosphorous are activated and thecobalt is selectively silicided in reaction with poly-Si layer 49, aspreviously shown with reference to FIGS. 3D and 3E. The resulting CoSi₂layer is shown as layer 51 in the gate stack structure, in accordancewith the present invention, shown in FIG. 1. This CoSi₂ layer is shownas layer 32 in the general gate stack used to describe the process inFIG. 2E.

Thus, while the thermal energy is being applied, the phosphorousimplanted regions 35 n and boron implanted regions 35 p are cured asshown in FIG. 2E, and the implanted regions are diffused to form shallowphosphorous-doped and shallow boron-doped source and drain regions, asshown at 36 n-38 n and 36 p-38 p.

While the ion-implanted dopant impurities are being activated in thedoped regions 35 n and 35 p, the thermal energy further acts to makethis ion-implanted phosphorous and ion-implanted boron active in thegate structures 21N and 21P. The small grain size of the Si nano crystallayer 41 in FIGS. 3A-3D acts to both enhance boron diffusion and aid ingate activation.

Although the thermal energy is such as to make the ion-implantedphosphorous highly activated, the Ge promotes complete activation andprovides higher solubility of the ion-implanted boron. On the otherhand, the upward diffusion of the Ge into the top of the stack isprevented by interfacial SiO₂ or Si_(x)Ge_(y)O_(z) layer 47, as shown inFIGS. 3D and 3E, whereby poly-Si/Co silicidation is carried out withoutthe use of a Ge barrier that causes resistance to current flow throughthe gate stack. In addition, the formation of the interfacial SiO₂ orSi_(x)Ge_(y)O_(z) layer 47 by the RTCVD process acts to minimize the Gediffusion into other layers.

A subsequent annealing step causes a reaction between the silicon at thetop of the gate stacks and the cobalt to thereby form CoSi₂ layer 32, aspreviously described. In addition, the cobalt also reacts with the dopedregions 36 n, 38 n, 36 p and 38 p to form CoSi₂ contacts 40 n, 42 n, 40p and 42 p in self-aligned fashion. The remaining cobalt of layer 30 isthen etched away.

With reference to the gate stack structure in accordance with thepresent invention, reference is made, again, to the pFET depicted inFIG. 1. The overall pFET structure shown in FIG. 1 is the same as thepFET structure shown in FIG. 2E except for the gate stack structure.Thus, in accordance with the present invention, the gate stack structureof FIGS. 2A-2E is replaced by the gate stack structure shown in FIG. 1and the fabrication process depicted in FIGS. 3A-3D. Although not shownin FIG. 1, it is clear that an nFET structure would, similarly, be thesame as the nFET structure shown in FIG. 2E with the same gate stackstructure shown in FIGS. 3A-3D. The gate stack structure shown in FIG.3E could readily replace the gate stack structure of FIG. 3D.

FIG. 1, then, shows a silicon epitaxial layer 1, an n-well layer 3 andp+ doped regions 19. Isolation region 5 defines the active area region.The gate stack 7 of the present invention sits on gate oxide 43. Thestack structure comprises Si nano crystal layer 41, poly SiGe layer 45,mono interfacial layer 47 and poly Si layer 49. Layers of CoSi₂ areshown at 51 and 57 with the remainder of the conformal cobalt layershown at 55. It is clear that the latter layer may be readily etchedaway and a layer of insulating material conformally deposited upon thestructure.

It will be understood from the foregoing description that variousmodifications and changes may be made in the preferred embodiment of thepresent invention without departing from its true spirit. It is intendedthat this description is for purposes of illustration only and shouldnot be construed in a limiting sense. The scope of this invention shouldbe limited only by the language of the following claims.

1. A method for fabricating a gate electrode of a field effecttransistor device, comprising the steps of: providing a semiconductorlayer having at least one gate insulating layer region on a portion ofsaid semiconductor layer and doped semiconductor regions adjacentthereto; depositing a Si nano crystal layer on said gate insulatinglayer; depositing a poly-SiGe alloy layer on said Si nano crystal layer;forming an oxide layer from said poly-SiGe layer sufficiently thin so asto offer little resistance to current flow and with sufficient [O] toblock upward Ge diffusion upon heating; and depositing a poly-Si layeron said oxide layer.
 2. The method as set forth in claim 1 wherein saidSi nano crystal layer is deposited from 3 to 6 nm thick with a grainsize of 20 to 150 Å in diameter.
 3. The method as set forth in claim 2wherein said Si nano crystal layer is deposited ex situ by spin-on of Sinano crystal from solution.
 4. The method as set forth in claim 1wherein the germanium concentration in said poly-SiGe alloy layer is upto at least 70% and the grain size of said alloy averages 400 Å.
 5. Themethod as set forth in claim 1 wherein said Si nano crystal layer andsaid poly-SiGe alloy layer are deposited in situ by rapid thermalchemical vapor deposition.
 6. The method as set forth in claim 1 whereinsaid oxide layer is 2 to 4 Å thick.
 7. The method as set forth in claim5 wherein said oxide layer is formed by an in situ purge of the rapidthermal chemical vapor deposition chamber in an oxygen ambient atrapidly reduced temperature levels of 300 to 500° C.
 8. The method asset forth in claim 1 including the steps of conformally depositing alayer of Co upon said poly-Si layer and said doped regions adjacentthereto and applying heat to said semiconductor layer to activate saiddoped regions and form CoSi₂ on poly-Si layer and said doped regions. 9.The method as set forth in claim 8 wherein said semiconductor layerhaving at least one gate insulating layer region comprises at least twogate insulating layer regions with one gate insulating layer regionformed on a p-type well and the other formed on an n-type well andwherein said p-type well is ion implanted with phosphorous or arsenicand said n-type well is ion implanted with boron so that said step ofapplying heat activates said phosphorous or arsenic and said boron withsaid Ge in said poly-SiGe enhancing said activation of boron.
 10. Amethod for fabricating a gate electrode of a field effect transistordevice, comprising the steps of: providing a semiconductor layer havingat least one gate insulating layer region on a portion of saidsemiconductor layer and doped semiconductor regions adjacent thereto;depositing a Si nano crystal layer on said gate insulating layer;depositing a poly-SiGe alloy layer on said Si nano crystal layer; afterdepositing said poly-SiGe alloy layer, growing in situ an oxide layerdirectly on said poly-SiGe alloy layer sufficiently thin so as to offerlittle resistance to current flow and with sufficient [O] to blockupward Ge diffusion upon heating; and depositing a poly-Si layer on saidoxide layer.
 11. The method as set forth in claim 10 wherein said Sinano crystal layer is deposited from 3 to 6 nm thick with a grain sizeof 20 to 150 Å in diameter.
 12. The method as set forth in claim 11wherein said Si nano crystal layer is deposited ex situ by spin-on of Sinano crystal from solution.
 13. The method as set forth in claim 10wherein the germanium concentration in said poly-SiGe alloy layer is upto at least 70% and the grain size of said alloy averages 400 Å.
 14. Themethod as set forth in claim 10 wherein said Si nano crystal layer andsaid poly-SiGe alloy layer are deposited in situ by rapid thermalchemical vapor deposition.
 15. The method as set forth in claim 10wherein said oxide layer is 2 to 4 Å thick.
 16. The method as set forthin claim 14 wherein said oxide layer is formed by an in situ purge ofthe rapid thermal chemical vapor deposition chamber in an oxygen ambientat rapidly reduced temperature levels of 300 to 500° C.
 17. The methodas set forth in claim 10 including the steps of conformally depositing alayer of Co upon said poly-Si layer and said doped regions adjacentthereto and applying heat to said semiconductor layer to activate saiddoped regions and form CoSi₂ on poly-Si layer and said doped regions.18. The method as set forth in claim 17 wherein said semiconductor layerhaving at least one gate insulating layer region comprises at least twogate insulating layer regions with one gate insulating layer regionformed on a p-type well and the other formed on an n-type well andwherein said p-type well is ion implanted with phosphorous or arsenicand said n-type well is ion implanted with boron so that said step ofapplying heat activates said phosphorous or arsenic and said boron withsaid Ge in said poly-SiGe enhancing said activation of boron.
 19. Amethod for fabricating a gate electrode of a field effect transistordevice, comprising the steps of: providing a semiconductor layer havingat least one gate insulating layer region on a portion of saidsemiconductor layer and doped semiconductor regions adjacent thereto;depositing a Si nano crystal layer on said gate insulating layer 3 to 6nm thick with a grain size of 20 to 150 Å in diameter; depositing apoly-SiGe alloy layer on said Si nano crystal layer with said poly-SiGealloy layer having a germanium concentration up to at least 70% and agrain size averaging 400 Å; forming a 2 to 4 Å thick oxide layer fromsaid poly-SiGe alloy layer which is sufficiently thin so as to offerlittle resistance to current flow and which has sufficient [O] to blockupward Ge diffusion upon heating; depositing a poly-Si layer on saidoxide layer; and depositing a layer of Co upon said poly-Si layer.